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Semiconductor Industry Daily News & Updates

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Semiconductor Industry Daily News & Updates

  • Designing semiconductor chips has traditionally been costly and controlled by a few major Electronic Design Automation (EDA) vendors—Cadence, Synopsys, and Siemens EDA who dominate with proprietary tools protected by NDAs and restrictive licenses. Fabrication also requires expensive, often export-controlled equipment.… Read More The post Free and Open Chip Design Tools: Opportunities, Challenges, and Outlook appeared […]
  • Many products are assembled from components manufactured and distributed separately, and it is important to consider how such products are manufactured when seeking to provide commercially valuable patent protection. This article provides an example in the field of computer chip manufacture. Chiplets A system-on-a-chip … Read More The post Chiplets: providing commercially valuable patent protection […]
  • This webinar, in partnership with Easy-Logic Technology, is to address the complexities and challenges associated with functional ECO (Engineering Change Order) in ASIC design, with a particular focus on mixed-signal designs. The webinar begins by highlighting the critical role of mixed-signal chips in modern applications,… Read More The post WEBINAR: Functional ECO Solution for Mixed-Signal […]
  • As modern computing systems evolve toward greater parallelism, multithreaded and distributed architectures have become the norm. While this shift promises increased performance and scalability, it also introduces a fundamental challenge: debugging concurrent code. The elusive nature of race conditions, deadlocks, … Read More The post Taming Concurrency: A New Era of Debugging Multithreaded Code appeared […]
  • GenAI is certainly changing the world. Every day there are new innovations in the use of highly trained models to do things that seemed impossible just a short while ago. As GenAI models take on more tasks that used to be the work of humans, there is always a nagging concern about accuracy and bias. […]
  • How advances and limitations are defined by the data. The post Machine Learning In Semiconductor Manufacturing appeared first on Semiconductor Engineering.
  • Intel lifelines; EU firms up chip deal; pros/cons of AI chip exports to China; HW weakness report; 95% failure in GenAI pilots; Air Liquide's $3.3B buy; Taiwan's silicon shield erosion; DeepSeek's new release; Ultra Ethernet; imec's high-density front-backside wafer connectivity. The post Chip Industry Week In Review appeared first on Semiconductor Engineering.
  • Reducing stresses on SiN and oxide layers is critical as memory approaches 300 layers. The post Why 3D NAND Layers Bend (And How To Prevent It) appeared first on Semiconductor Engineering.
  • Predict the intrinsic physical behavior of new materials before they are even synthesized. The post Materials Modeling Of Superconducting Qubits In Quantum Computers appeared first on Semiconductor Engineering.
  • Sub-micron hybrid bonding is set to change how chips are made, but challenges remain. The post Manufacturing At The Limits appeared first on Semiconductor Engineering.
  • Catching partially defective die before they make it into a product. The post How Guardbanding Of Inline Wafer Defects Can Improve Chip Reliability Insurance appeared first on Semiconductor Engineering.
  • Scanner improvements, bridges, and panels may bring relief. The post Reticle Stitching Bumps Up Silicon Interposer Costs appeared first on Semiconductor Engineering.
  • Striving towards net zero greenhouse gas emissions by 2050 and renewable energy goals, UMC takes decisive climate actions. The post 2024 UMC Sustainability Report appeared first on Semiconductor Engineering.
  • Why have wafer shipments remained flat while AI semiconductor demand is booming and fab investments are rising? The post From Latency To Reaction: Simulating The Next Wafer Demand Inflection appeared first on Semiconductor Engineering.
  • Ruthenium plays a key role at advanced nodes, but it's not a wholesale replacement. The post The End Of Copper Interconnects? appeared first on Semiconductor Engineering.
  • For its fiscal full-year 2025 (ended 28 June), Lumentum Holdings Inc of San Jose, CA, USA (which designs and makes optical and photonic products for optical networks and lasers for industrial and consumer markets) has reported revenue of $1645m, up 21% on $1359.2m in fiscal 2024…
  • TriEye Ltd of Tel Aviv, Israel — which claims to have pioneered the first CMOS-based shortwave infrared (SWIR) sensing technology — and optoelectronic and power management firm LITEON Technology of Hsinchu, Taiwan have partnered to deliver a vertical-cavity surface-emitting laser (VCSEL)-powered SWIR sensing and imaging solution…
  • NUBURU Inc of Centennial, CO, USA — which was founded in 2015 and developed and previously manufactured high-power industrial blue lasers — has successfully executed the first milestone under the phased acquisition plan for Tekne S.p.A. established following formal notice received from the Italian government under the ‘Golden Power’ framework…
  • ams OSRAM of Premstaetten, Austria and Munich, Germany has evaluated a new UV-C LED emitting at a wavelength of 265nm, with a lifespan exceeding 20,000 hours, that delivers over 10% efficiency at 200mW power, as validated by Germany’s National Metrology Institute Physikalisch-Technische Bundesanstalt (PTB). With these specifications, the UV-C LED can replace conventional mercury discharge […]
  • Invest Ontario is supporting an investment of over $100m by Ranovus Inc of Ottawa, Ontario, Canada (which develops and manufactures multi-terabit photonics interconnect solutions for data-center and communications networks) to develop and scale optical semiconductors that are powering the next generation of artificial intelligence (AI) infrastructure. The project will expand Ranovus’ manufacturing facility in Ottawa […]
  • AXT Inc of Fremont, CA, USA – which makes gallium arsenide (GaAs), indium phosphide (InP) and germanium (Ge) substrates and raw materials – says that its China-based manufacturing subsidiary Beijing Tongmei Xtal Technology Co Ltd has been informed that it has satisfied the applicable requirements for a permit to export indium phosphide and has received […]
  • Independent power electronics company Quantum Power Transformation (QPT) Ltd of Cambridge, UK — which was founded in 2019 and develops gallium nitride (GaN)-based electric motor controls — has unveiled MicroDyno, a low-voltage motor drive test platform which demonstrates the key benefits of ultrahigh-frequency GaN-based motor drives. The solution enables greater control and efficiency with lower […]
  • Tokyo-based Oki Electric Industry Co Ltd has developed Tiling crystal film bonding (CFB) technology using its proprietary CFB technology. The technology enables the heterogeneous integration of small-diameter optical semiconductor wafers onto 300mm silicon wafers, previously not possible due to wafer size restrictions, and will contribute to the advancement of rapidly growing photonics-electronics convergence technology. OKI […]
  • k-Space Associates Inc of Dexter, MI, USA — which produces thin-film metrology instrumentation and software — says that its new kSA RHEEDSim reflection high-energy electron diffraction (RHEED) simulation software is now available for both labs and classrooms…
  • ClassOne Technology of Kalispell, MT, USA (which manufactures electroplating and wet-chemical process systems for ≤200mm wafers) is providing its Solstice S8 single-wafer processing system to Applied Optoelectronics Inc (AOI) of Sugar Land, TX, USA, a designer and manufacturer of optical components, modules and equipment for fiber access networks in the Internet data-center, cable TV broadband, […]