… with the United States in semiconductor design, estimating the difference is …

… , the views on the broader semiconductor and chipmaking industry act as … like today. The Upcycle in Semiconductors Has Begun The industry dynamic … . rolling out their Blackwell super semiconductor in the latest quarter, investors …

… .7K 18 302 About Taiwan Semiconductor Taiwan Semiconductor Manufacturing Co. is the world … -edge process technologies to its semiconductor designs. TSMC employs more than … options activities associated with Taiwan Semiconductor, we pivot to a closer …

… enforcement focus on AI and semiconductors. BIS said that it will … . “High probability” enforcement targeting Chinese semiconductors Additionally, BIS warns of a … enforcement priorities around AI and semiconductors until a new rule is …

Texas Instruments unleashes $60B American semiconductor revolution, creating 60,000 … , marking the largest foundational semiconductor manufacturing expansion in U.S … based @TXInstruments continues to spearhead semiconductor innovation and create thousands of …

… $60 billion in U.S. semiconductor manufacturing facilities, an initiative that … will impact seven U.S. semiconductor “fabs,” or fabrication plants at … earmarked for TI’s existing semiconductor fabs in the North Texas …

Why buy what your neighbor already has? Rent tools, gear & more through RUOS App. CHARLOTTE, NC, UNITED STATES, June 20, 2025 /⁨EINPresswire.com⁩/ — Ruos Rental App Boosts Neighborhood Economy and Circular Living Across U.S. Communities …

The case was resolved on the heels of a $51.7 million damages award with plaintiff ams OSRAM taking advantage of a ‘no-win no-fee’ funding arrangement Register for limited access Register to receive our newsletter and gain limited access to subscriber …

… efforts in AI model development, semiconductor design, and cloud infrastructure. The … Bodhi 2, its proprietary AI semiconductor chips, which are now in …

Ollie is a commercially astute senior leader with over 20 years of experience in strategy, business development and sales across the technology and engineering sectors, with a strong track record in scaling businesses and driving growth. He has held commercial leadership roles in FTSE 100, private equity-backed, and startup… Read More The post The Sondrel […]

Keysight Showcases AI-Ready EDA and Multi-Physics Innovation at #62DAC Design engineers attending #62DAC who focus on Design Data & IP Management, Analog, Mixed-Signal, RFIC, MMIC, or Multi-Physics should make booth #1408 a top destination. I had the opportunity to speak with Simon Rance, General Manager & Business… Read More The post Keysight at the 2025 […]

Clock Matters: What Infinisim Is Showcasing at DAC 2025 Optimize by Finding and Fixing Errors Across the Entire Clock Domain The clock domain is the heartbeat of every high-performance SoC—and at DAC 2025, Infinisim is redefining how design teams approach clock optimization with speed, precision, and confidence. If you’re… Read More The post Infinisim at […]

I wrote recently about a Siemens pre-announcement at DVCon on their directions in simulation+AI. On May 13th they officially announced a full spectrum of capabilities under the brand Questa One. Abhi Kolpekwar (VP/GM at Siemens EDA) more fully fleshed out the story for me. I asked why Siemens is late to this simulation+AI party.… Read […]

Empyrean at DAC 2025: Full-Flow AMS/PMIC, SPICE Simulation, and AI-Accelerated Library Characterization Empyrean returns to DAC 2025, showcasing our most advanced EDA solutions that power next-generation chip designs. This year, we spotlight three critical innovation areas: AMS & PMIC Design Solutions Empyrean … Read More The post Empyrean at the 2025 Design Automation Conference #62DAC appeared […]

A new technical paper titled “Machine Intelligence on Wireless Edge Networks” was published by researchers at MIT and Duke University. Abstract “Deep neural network (DNN) inference on power-constrained edge devices is bottlenecked by costly weight storage and data movement. We introduce MIWEN, a radio-frequency (RF) analog architecture that “disaggregates” memory by streaming weights wirelessly and… […]

A new technical paper titled “Domain Adaptation for Image Classification of Defects in Semiconductor Manufacturing” was published by researchers at Infineon Technologies, University of Padova and University of Bologna. Abstract “In the semiconductor sector, due to high demand but also strong and increasing competition, time to market and quality are key factors in securing significant… […]

$60B fab buildout; Chinese automakers tout 100% homemade chips; 2nm custom SRAM; Cadence's virtual platform buy; multi-chiplet NoC; HBM roadmap; MIT's GaN fab technique; 30% tax credit; Taiwan export restrictions, power vulnerability; global memory market; rad-tolerant memory; 2D, non-silicon computer. The post Chip Industry Week in Review appeared first on Semiconductor Engineering.

Determining whether stress during finFET polysilicon sacrificial gate creation and removal could lead to failures. The post Examining Mechanical Deformation In Advanced Logic Devices To Enhance Yield appeared first on Semiconductor Engineering.

Rising power densities and new architectures are forcing a rethinking of interconnects, materials, and thermal management. The post Power Delivery Challenges For AI Chips appeared first on Semiconductor Engineering.

Addressing problems early can reduce downtime in the fab and prevent reliability time bombs. The post How To Catch “Disappearing” Latent Defects appeared first on Semiconductor Engineering.

Linearity correction and uniformity enhancement for Manhattan and curvilinear masks. The post Variable Bias Completes The PLDC Model And Offers Superior MPC Results appeared first on Semiconductor Engineering.

Identifying latent behaviors in a wide variety of data sources. The post Improving Fab Engineering Efficiency With Autonomous Data Analytics appeared first on Semiconductor Engineering.

Thin lines and limited ground planes keep RDL interconnects short. The post Physics Limits Interposer Line Lengths appeared first on Semiconductor Engineering.

Effective collaboration across the supply chain is crucial for achieving carbon reduction goals. The post Path To Net-Zero Emissions In IC Packaging appeared first on Semiconductor Engineering.

Ascent Solar Technologies Inc of Thornton, CO, USA – which designs and makes lightweight, flexible copper indium gallium diselenide (CIGS) thin-film photovoltaic (PV) modules that can be integrated into consumer products, off-grid applications and aerospace applications – has signed a master services agreement with NOVI Space Inc, a Virginia-based space AI infrastructure & compute company […]

Ascent Solar Technologies Inc of Thornton, CO, USA says that its flexible thin-film copper indium gallium diselenide (CIGS) photovoltaic (PV) technology has reached record energy conversion efficiency of 15.7% (AM0) at production scale. The achievement aligns with the firm’s previously announced 2025 strategy, which aimed to continue improving on its thin-film PV’s material quality, technological […]

Materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA has launched the COMPACT EVOLUTION AC, a next-generation compact, air-cooled 500W diode laser system for polymer welding…

Process equipment maker Applied Materials Inc of Santa Clara, CA, USA and micro/nanotechnology R&D center CEA-Leti of Grenoble, France have announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Through an expansion of their joint lab, the organizations plan to develop materials engineering solutions to address emerging infrastructure challenges in […]

Using the Fiji G2 plasma-enhanced atomic layer deposition (PEALD) system of epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA, the University of Michigan has reported the ALD of molybdenum disulfide (MoS2) using di-tert-butyl disulfide (TBDS) as a replacement for hydrogen sulfide (H2S) (Chemistry of Materials vol 37, issue 4, 11 […]

Molecular beam epitaxy (MBE) system maker Riber S.A. of Bezons, France has signed a three-year collaborative partnership with the Denmark-based Novo Nordisk Foundation Quantum Computing Programme (NQCP), a research initiative launched by the Novo Nordisk Foundation in collaboration with the Niels Bohr Institute at the University of Copenhagen…

Marktech Optoelectronics Inc of Latham, NY, USA, a vertically integrated designer and manufacturer of optoelectronics components and assemblies, has released its new high-efficiency 25µm-diameter resonant-cavity light-emitting diodes (RCLEDs) with a peak emission at 650nm, which it claims set a new benchmark for performance in precision optical targeting applications…

Hong Kong-based UGREEN (which provides charging accessories) has unveiled the Nexode 500W 6-Port GaN Desktop Fast Charger, which is claimed to be the first 500W gallium nitride (GaN) charger engineered to simultaneously charge six devices with unprecedented power. Combining groundbreaking charging power, intelligent safety systems, and near-universal compatibility, it is built to handle the high-performance […]

Resonantly tunable quantum cascade lasers (QCLs) are high-performance laser light sources for a wide range of spectroscopy applications in the mid-infrared (MIR) range. Their high brilliance enables minimal measurement times for more precise and efficient characterization processes and can be used, for example, in chemical and pharmaceutical industries, medicine or security technology. Until now, however, […]

Materials, networking and laser technology firm Coherent Corp of Saxonburg, PA, USA has launched the SES18-880A-190-10, a high-power 880nm single-emitter laser diode on sub mount, designed specifically for high-efficiency, high-reliability pumping of diode-pumped solid-state (DPSS) lasers…