… and even build semiconductor supply chains independent … licensing requirements for semiconductors exported to China … 39;s mature-node semiconductors, meaning chip-processing technology … branch of the China Semiconductor Industry Association, said: …

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… ), SentinelOne, Inc. (NYSE: S), ON Semiconductor Corporation (NASDAQ: ON). Super Micro … ;s guidance was overstated. ON Semiconductor Corporation (NASDAQ: ON) Johnson Fistel … .com/investigations/on-semiconductor-corporation  Previously a class action …

… tariffs on imports of semiconductors, semiconductor manufacturing equipment (“SME”), … Scope The semiconductors investigation covers: Semiconductors, including semiconductor substrates and bare … downstream products containing semiconductors and making up the …

… That Executive Order excluded semiconductor and pharmaceutical products from … pharmaceutical ingredients and (ii) semiconductors, semiconductor manufacturing equipment (“SME”), … to pharmaceuticals, pharmaceutical ingredients, semiconductors, SME, and their …

… ’s attempt to restructure global semiconductor supply chains through political intervention … ($800 million). Also Read: Taiwan Semiconductor CFO Anticipates Tariffs Impact But … report said. In March, Taiwan Semiconductor announced an additional $100 billion …

… business conflict. Since 2017, Hanmi Semiconductor has been the exclusive supplier … situation further intensified when Hanmi Semiconductor filed a patent infringement lawsuit … As tensions continue between Hanmi Semiconductor and SK Hynix, industry observers …

… right across the street for semiconductor supply chain companies. The Onondaga … year on a $100 billion semiconductor fabrication complex. The properties are … Technology Inc.'s planned semiconductor fabrication plant. (Rick Moriarty | rmoriarty …

Backed by Hatcher+ and Startupbootcamp, PayToMe.co scales its award-winning AI-powered Financial Operating System for SMBs and enterprises worldwide. SAN FRANCISCO, CA, UNITED STATES, April 22, 2025 /⁨EINPresswire.com⁩/ — PayToMe.co, the world’s …

President Donald Trump has initially excluded semiconductors from his latest round of U.S. tariffs. However, he could put tariffs on semiconductors in the future. If tariffs are placed on semiconductors imported to the U.S., how would that affect U.S.-based semiconductor companies? The chart below shows U.S. semiconductor… Read More The post Semiconductor Tariff Impact appeared […]

At NVIDIA’s recent GTC conference, a Cadence-NVIDIA joint session provided insights into how AI-powered innovation is reshaping the future of data center infrastructure. Led by Kourosh Nemati, Senior Data Center Cooling and Infrastructure Engineer from NVIDIA and Sherman Ikemoto, Sales Development Group Director from … Read More The post Designing and Simulating Next Generation Data […]

Dr. Michael Förtsch, CEO of Q.ANT, is a physicist and innovator driving advancements in photonic computing and sensing technologies. With a PhD from the Max Planck Institute for the Science of Light, he leads Q.ANT’s development of Thin-Film Lithium Niobate (TFLN) technology, delivering groundbreaking energy efficiency … Read More The post CEO Interview with Dr. […]

IC designs need to operate reliably under varying conditions and avoid inefficiencies like leakage across power domains. But how do you verify that connections between IP blocks has been done properly? This is where reliability verification, Electrical Rule Checking (ERC) tools and dynamic simulations all come into play particularly… Read More The post Verifying Leakage […]

At the 2025 NVIDIA GTC Conference, CEO Jensen Huang delivered a sweeping keynote that painted the future of computing in bold strokes: a world powered by AI factories, built on accelerated computing, and driven by agentic, embodied AI capable of interacting with the physical world. He introduced the concept of Physical AI—intelligence… Read More The […]

A new technical paper titled “Hardware-based Heterogeneous Memory Management for Large Language Model Inference” was published by researchers at KAIST and Stanford University. Abstract “A large language model (LLM) is one of the most important emerging machine learning applications nowadays. However, due to its huge model size and runtime increase of the memory footprint, LLM… […]

GenAI for analog; water immersion cooling; 2D materials roadmap; stochastic computing ReRAM; sub-10nm nanogap; pre-silicon HW trojans; C2RAM on FDSOI; cache coherence traffic for NoC routing; HW IP protection. The post Chip Industry Technical Paper Roundup: Apr. 22 appeared first on Semiconductor Engineering.

Photonic AI: Heterogeneous integration; nonlinear neural network training; acoustically-mediated activation function. The post Research Bits: April 22 appeared first on Semiconductor Engineering.

Data sharing becomes more challenging when AI and multi-die assemblies are involved. The post Secure Handling Of Financial Data In Manufacturing appeared first on Semiconductor Engineering.

Determining the impact of temperature on electrical performance. The post Co-Design Optimization For PI/SI When Considering Thermal Performance appeared first on Semiconductor Engineering.

TSMC, ASML earnings; 2nm processor; HBM4; touch controllers for foldable OLED displays; $500B AI supercomputer buildout; NVIDIA, AMD export licenses; Cadence's acquisition; DRAM, NAND flash; rare earths dry up; new EV chips. The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

Wafer thinning and TSV formation can introduce mechanical stress and impact device integrity in advanced transistor architectures. The post The Other Side Of The Wafer: Transistor Channel Stress In Backside Power Delivery Networks appeared first on Semiconductor Engineering.

GPUs provide better speed and capacity for very large designs, enabling design and system technology co-optimization. The post TCAD For GPUs And GPUs For TCAD appeared first on Semiconductor Engineering.

The economics are not yet clear for industrial or consumer electronics. The post Can Chiplets Serve Cost-Conscious Apps? appeared first on Semiconductor Engineering.

Enhancing the performance and reliability of power modules through thermal management. The post Innovation And Collaboration In Power Module Packaging: A Thermal Perspective appeared first on Semiconductor Engineering.

As demand grows for scalable, energy-efficient, high-capacity connectivity in short-reach environments, Optical Internetworking Forum (OIF) has released the 800LR Implementation Agreement (IA) defining a single-wavelength 800G coherent line interface…

NUBURU Inc of Centennial, CO, USA — which was founded in 2015 and develops and manufactures high-power industrial blue lasers — has announced a strategic update that, it says, underscores its commitment to advancing into high-growth markets. It has also secured funding partners to address up to about $3.4m in accounts payables left from previous […]

Lumentum Holdings Inc of San Jose, CA, USA (which designs and makes optical and photonic products for optical networks and lasers for industrial and consumer markets) has earned the EcoVadis Platinum Medal for a third consecutive year — representing the highest level of recognition for sustainability performance, and reflecting its “culture of continuous improvement and […]

Gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA has released its latest SiCPAK power modules with epoxy-resin potting technology, powered by proprietary trench-assisted planar SiC MOSFET technology, that have been rigorously designed and validated for the most demanding high-power environments, prioritizing reliability and high-temperature performance. […]

At booth 304 (hall 9) at the Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (PCIM 2025) Expo & Conference in Nuremberg, Germany (6–8 May), ROHM is showcasing reference projects with partners and presenting the evolution of its package designs and evaluation boards. Highlights include the following…

Professor Can Bayram and his colleagues at University of Illinois at Urbana-Champaign (UIUC) in the USA have reported diamond photoconductive semiconductor switches (PCSS) with record-breaking voltage/current handling and slew rates, efficiency and reliability simultaneously (Z. Han et al, ‘Record Performance in Intrinsic, Impurity-Free Lateral Diamond Photoconductive Semiconductor Switches’ Appl. Phys. Lett. 126, 152105 (2025)…

Compound Semiconductor Applications (CSA) Catapult says that Dr Jayakrishnan (Jay) Chandrappan, its head of technology – advanced packaging, has been appointed visiting industrial professor at the University of Bristol and visiting professor at the University of Strathclyde…

Polar Semiconductor of Bloomington, MN, USA (the only US-owned merchant foundry specializing in sensor, power and high-voltage semiconductors) has finalized a strategic agreement with Renesas Electronics Corp of Tokyo, Japan to license its gallium nitride-on-silicon (GaN-on-Si) D-mode technology…

The SEMI Silicon Photonics Industry Alliance (SiPhIA) has held the ‘Bridging Light & Silicon: SEMI SiPhIA SIGs Kick-off & Seminar’, announcing the official launch of three Special Interest Groups (SIGs) aimed at integrating expertise from various sectors to formulate industry standards and accelerate technological innovation and commercialization. K.C. Hsu, vice president of TSMC, and Dr […]

Gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA has announced that its high-power GaNSafe ICs have achieved automotive qualification for both AEC-Q100 and AEC-Q101, showcasing GaN’s next inflection into the automotive market, it is reckoned…