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Semiconductor Industry Daily News & Updates

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Semiconductor Industry Daily News & Updates

  • Tell us a little bit about yourself and your company.  I am the CEO of Finwave Semiconductor and joined the company in June 2023. I have close to 40 years of experience in the semiconductor industry, and I have worked in France, Japan and the United States. I have been in Silicon Valley for the last […]
  • As usual I check in on Accellera activities each year at DVCon. Lu Dai (chair) gave an opening talk at the Accellera lunch, with contributions from other speakers on a few topics. In the afternoon I heard an update on PSS 3.0. What follows is a quick summary with my own musings on behavioral coverage. […]
  • Matt Desch is the Chief Executive Officer of Iridium Communications Inc., the only satellite communications company that offers truly global voice and data coverage. He has more than 40 years of experience in telecommunications management, and more than 30 years in the global wireless industry. Joining Iridium in 2006, Desch… Read More The post CEO […]
  • Custom and analog/mixed-signal IC designs have some unique IP and symmetry checking requirements for physical design. Waiting until the end of the IC layout process to verify IP instances for correctness or proper symmetry will cause project delays, so an approach to perform earlier physical verification makes more sense. … Read More The post Speeding […]
  • The tech world is sprinting toward a future where your fridge orders groceries, your car avoids traffic before you hit it, and security cameras don’t just watch—they understand. But behind these innovations lies a messy truth: building the brains for these smart systems is complicated. Fresh off the 2024 Arm Tech Symposia… Read More The post S2C: Empowering Smarter […]
  • A new technical paper titled “Cool-3D: An End-to-End Thermal-Aware Framework for Early-Phase Design Space Exploration of Microfluidic-Cooled 3DICs” was published by researchers at University of Michigan, Shanghai Jiao Tong University and University of Virginia. Abstract “The rapid advancement of three-dimensional integrated circuits (3DICs) has heightened the need for early-phase design space exploration (DSE) to minimize… […]
  • The benefits of integrating DUV spectroscopic ellipsometry with laser ellipsometry for gate oxide metrology. The post Measuring Multi-Layer Ultra-Thin Critical Films appeared first on Semiconductor Engineering.
  • Integrating the functionality of the HBM base die into a logic die provides greater flexibility and additional control. The post Speeding Down Memory Lane With Custom HBM appeared first on Semiconductor Engineering.
  • Better tools, automation, and analytics improve FA, but determining the cause of failure is still difficult. The post Automation And AI Improve Failure Analysis appeared first on Semiconductor Engineering.
  • Diagnosis-driven yield analysis helps uncover previously unknown systematic issues and reduce physical failure analysis cycle time. The post Unlocking The Value Of Yield appeared first on Semiconductor Engineering.
  • Mixing financial data with manufacturing analytics can boost efficiency, but there are still pockets of resistance. The post Cutting IC Manufacturing Costs By Combining Data appeared first on Semiconductor Engineering.
  • Improve scan chain diagnosis resolution by 4X. The post Reversible Chain Diagnosis appeared first on Semiconductor Engineering.
  • Co-packaged optics require hybrid testing systems with reliable alignment techniques that can handle both electrical and optical signals simultaneously. The post Silicon Photonics Raises New Test Challenges appeared first on Semiconductor Engineering.
  • Test-flow stages must become dynamically adaptable with real-time decision-making. The post AI Semiconductors Require An Integrated Test Solution appeared first on Semiconductor Engineering.
  • Fundamental changes are needed in failure analysis to keep pace with changes in chip technology. The post Failure To Launch appeared first on Semiconductor Engineering.
  • BluGlass Ltd of Silverwater, Australia has reported what is reckoned to be record single-spatial-mode power of 1250mW from a single gallium nitride (GaN) laser chip, an increase of more than 67% from the prior 750mW (reported as recently as January, at Photonics West 2025, demonstrating the rapid growth of the firm’s technology capabilities)…
  • On 13 and 21 January, respectively, the Munich District Court of Germany ruled in favor of Nichia Corp of Tokushima, Japan — the world’s largest gallium nitride (GaN)-based light-emitting diode/laser diode (LED/LD) manufacturer and inventor of high-brightness blue and white LEDs — in two patent infringement lawsuits and issued two acknowledgment judgments in relation to […]
  • MACOM Technology Solutions Inc of Lowell, MA, USA (which designs and makes RF, microwave, analog and mixed-signal and optical semiconductor technologies) is showcasing its latest satellite communications products in booth 1333 at SATELLITE 2025 in the Walter E. Washington Convention Center, Washington DC, USA (11–13 March)…
  • Fabless firm Cambridge GaN Devices Ltd (CGD) — which was spun out of the University of Cambridge in 2016 to design, develop and commercialize power transistors and ICs that use GaN-on-silicon substrates — has revealed more details about a solution that will enable it to address electric vehicle (EV) powertrain applications over 100kW (a market […]
  • Due to “high demand and requests from several participants”, there has been an extension to 17 March (14:00 Norwegian time) of the auction (begun on 28 February) of the assets of CrayoNano AS of Trondheim, Norway — a developer and manufacturer of semiconductor components, including UVC-LEDs, based on patented and proprietary nanomaterials technology, until its […]
  • Specialty semiconductor and performance materials producer 5N Plus Inc (5N+) of Montreal, Québec, Canada has entered into an exclusive agreement (through its subsidiary AZUR SPACE Solar Power GmbH of Heilbronn, Germany) with ALLOS Semiconductors GmbH of Dresden, Germany — which provides 200mm and 300mm GaN-on-silicon micro-LED epiwafers, as well as licensing IP and transferring the […]
  • NUBURU Inc of Centennial, CO, USA — which was founded in 2015 and develops and manufactures high-power industrial blue lasers — has announced a strategic partnership with artificial intelligence and robotics solutions provider COEPTIS Inc’s NexGenAI Affiliates Network (an AI-powered affiliate marketing platform designed to streamline marketing efforts through automation and advanced analytics). The collaboration […]
  • Luminus Devices Inc of Sunnyvale, CA, USA — which designs and makes LEDs and solid-state technology (SST) light sources for illumination markets — has released its Generation 2 warm dimming COB (chip on board) LEDs, engineered to deliver an lighting that mimics the warm glow of traditional incandescent and halogen sources while offering the efficiency […]
  • Japan-based ROHM Co Ltd says that its EcoGaN series of 650V GaN HEMTs in the TOLL package has been adopted by Murata Manufacturing Group subsidiary Murata Power Solutions (a Japan-based supplier of electronic components, batteries and power supplies) for AI server power supplies that will enter mass production this year. ROHM says that integrating its […]
  • k-Space Associates Inc of Dexter, MI, USA — which was founded in 1992 and produces thin-film metrology instrumentation and software for research and manufacturing of microelectronic, optoelectronic and photovoltaic devices — has introduced kSA RHEED-Sim as its new reflection high-energy electron diffraction (RHEED) simulation software. Suitable for both researchers and students, simulation possibilities range from […]