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Semiconductor Industry Daily News & Updates

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Semiconductor Industry Daily News & Updates

  • In a significant move aimed at empowering semiconductor and systems-design engineers, MZ Technologies has announced the launch of a new video series focused on advanced packaging design. This initiative comes at a time when the semiconductor industry is rapidly shifting toward multi-die, 2.5D/3D integration, heterogeneous… Read More The post MZ Technologies Launches Advanced Packaging Design […]
  • There is a new breed of EDA emerging. Until recently, EDA tools were focused on building better chips, faster and with superior quality of results. Part of that process is verifying and debugging the resultant design. Thanks to ubiquitous AI workloads and multi-chip architectures, the data to be verified and debugged is exploding,… Read More […]
  • Industrial control systems (ICS) underpin the world’s most critical infrastructure: power grids, manufacturing plants, transportation networks, water systems, oil and gas facilities, and chemical processing operations. For decades, these systems relied on isolation, proprietary communication protocols, and hardware… Read More The post The Quantum Threat: Why Industrial Control Systems Must Be Ready and How PQShield […]
  • In a field as white-hot as AI it can be difficult to separate cheerleading from reality. I am as enthusiastic as others about the potential but not the “AI everywhere in everything” message that some emphasize. So it was interesting to find a survey which looks at the deployment reality outside our narrow domain of […]
  • By Jason Liu, RFIC-GPT Inc. Radio frequency integrated circuits (RFICs) have become increasingly critical in modern electronic systems, driven by the rapid growth of wireless communication technologies (5G/6G), the Internet of Things (IoT), and advanced radar systems. With the desire for lower power consumption, higher… Read More The post Radio Frequency Integrated Circuits (RFICs) Generated […]
  • IEDM announcement blitz; Arteris' security buy; Qualcomm's RISC-V acquisition; UMC photonics; Nvidia H200 to China; 1.4nm patterning; standard package HBM; earnings; US rare earths surprise; $475M analog AI chip funding; PCIe security warning. The post Chip Industry Week in Review appeared first on Semiconductor Engineering.
  • A new technical paper titled “Chiplet technology for large-scale trapped-ion quantum processors” was published by researchers at University of Innsbruck, Alpine Quantum Technologies GmbH, and Fraunhofer Institute for Silicon Technology ISIT. Abstract “Trapped ions are among the most promising platforms for realizing a large-scale quantum information processor. Current progress focuses on integrating optical and electronic… […]
  • A new technical paper titled “Automated Enumeration of Reconfigurable Architectures for Thermal Management Systems in Battery Electric Vehicles” was published by researchers at University of Illinois at Urbana-Champaign, Ford Motor Company, and Kyushu University. Abstract “As the automotive industry moves towards vehicle electrification, designing and optimizing thermal management systems (TMSs) for Battery Electric Vehicles (BEVs)… […]
  • Choosing the right problems for AI to tackle will be crucial. The post AI In A/MS IC Design: Between Buzzword And Productivity Boost appeared first on Semiconductor Engineering.
  • Modern compute is pushing far more data than prior generations of I/O were designed for. The post PCIe 8.0: Preparing For The Next Doubling appeared first on Semiconductor Engineering.
  • An ancient data point proves a modern transformation. The post AI Moves Out Of The Cloud And Onto The Edge appeared first on Semiconductor Engineering.
  • Ensure robust, scalable, and secure data transport across heterogeneous sensor arrays. The post MIPI CSI-2 Provides The Backbone Of Automotive Sensor Networks appeared first on Semiconductor Engineering.
  • High utilization, low memory movement, and broad model compatibility can coexist. The post Next Generation AI: Transitioning Inference From The Cloud To The Edge appeared first on Semiconductor Engineering.
  • Thermal constraints directly influence floorplanning, macro placement, and power delivery network topology. The post Thermal Management In 3D-IC: Modeling Hotspots, Materials, & Cooling Strategies appeared first on Semiconductor Engineering.
  • How CPU-based embedding, unified memory, and local retrieval workflows come together to enable responsive, private RAG pipelines on desktop AI platforms. The post Rethinking The Role Of CPUs In AI: A Practical RAG Implementation appeared first on Semiconductor Engineering.