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TSMC is describing an artificial intelligence boom that reaches beyond accelerator chips into the wider computing infrastructure needed to support increasingly capable AI systems. On the recent investor call, Chairman and CEO Dr. C.C. Wei presents strong demand, persistent supply constraints and an ambitious expansion … Read More The post TSMC’s AI Expansion Signals a […]

By Shaurya Seth Terafab is one of the most ambitious projects of the decade: $16.8 billion for phase one and up to $119 billion across four phases. A research fab in Austin iterates on process recipes, transistor designs, and packaging variants at a few thousand wafers per month. A volume fab in Grimes County targets […]

Design the right chip. Design the chip right. Every verification methodology in mainstream use answers the second half of that sentence and assumes the first. Simulation, emulation, formal, constrained-random testbenches, coverage closure — all of them take a specification as given and ask whether the implementation matches… Read More The post Design the Right Chip: […]

The next gains from AI in semiconductors will come less from models and more from making fab and test data reliable, connected and tied to engineering decisions. By Sriram Nithin Gopal Lanka Every few months there is a new AI model that can do more and semiconductor manufacturers are under pressure to put them to […]

Artificial intelligence is becoming part of the infrastructure that powers healthcare, transportation, finance, manufacturing, and everyday digital services. As these systems grow more capable, they also process more sensitive information and depend on increasingly complex hardware. The Synopsys white paper, “Securing… Read More The post Why AI Security Starts at the Chip Level appeared first […]

Fab expansion accelerates; China advances memory and EUV; Teradyne's test deal; SEMICON West and OCP highlights; 3D SiP; TSMC and ASML signals; 300mm fab spending; optical and 3D-compute startups raise fresh funding; quantum HW advances. The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

Multiple interacting factors span silicon design, controller intelligence, channel quality, and the transmission medium itself. The post Beyond The Specification: What Really Determines PCIe Retimer Reach? appeared first on Semiconductor Engineering.

Short-resilient via insertion improves reliability and performance. The post Strengthening Advanced-Node Interconnects Through Automated Via Insertion appeared first on Semiconductor Engineering.

Open interfaces and interoperability allow designers to choose technologies based on the needs of the system. The post Building AI Infrastructure For Greater Choice And Flexibility appeared first on Semiconductor Engineering.

Extending chiplet connectivity across AXI and CHI with scalable protocol subsets, interoperability, and flexible transport support. The post AMBA C2C: Moving Forward With A Converged AMBA Foundation For C2C Connectivity appeared first on Semiconductor Engineering.

Proprietary models still hold the edge, but open-weight models add more flexibility for deploying AI. The post Why Open-Weight AI Matters appeared first on Semiconductor Engineering.

Agentic workloads increase CPU demand, while reasoning models, MoE architectures, and reservoir computing fuel AI acceleration. The post Agentic AI Alters The CPU-GPU Balance appeared first on Semiconductor Engineering.

Synopsys CEO Sassine Ghazi talks about AI agents, the limits of autonomous engineering, digital twins, and the challenges facing 3D-ICs. The post How Close Are We To Fully Autonomous Chip Design? appeared first on Semiconductor Engineering.

Ensuring optical engines can operate reliably alongside high-power AI processors in multi-chip packages. The post Thermal Co-Simulation Testing Of Co-Packaged Optics appeared first on Semiconductor Engineering.

Researchers at ETH Zürich and New York University published a technical paper titled “Understanding the Power Consumption of Modern High Bandwidth Memory: Experimental Analysis and Modeling Using Real HBM2 DRAM Chips.” Abstract Excerpt: “We perform the first comprehensive experimental characterization of power consumed by real HBM2 DRAM chips. Our extensive characterization yields 1) the empirical… […]

Power Integrations Inc of San Jose, CA, USA (which provides high-voltage integrated circuits for energy-efficient power conversion) and Ideal Power Inc (developer and provider of the B-TRAN bidirectional semiconductor power switch) are collaborating to deliver a solid-state circuit breaker (SSCB) solution providing fast, efficient, always-on protection that scales with the 800VDC transition in AI data […]

According to market research firm Omdia’s preliminary estimates, global smartphone shipments fell 20% year-on-year in third-quarter 2026, a sharp acceleration from the 6% decline recorded the previous quarter. Shipments also declined sequentially despite new flagship launches and channel preparations for the year-end festive season. Persistent memory and storage cost pressures have constrained pricing flexibility and […]

The Department of Commerce’s CHIPS Program Office has agreed with GlobalFoundries of Malta, NY (the only US-based pure-play foundry with a global manufacturing footprint) to amend its existing award and reallocate up to $955m in incentives under the US CHIPS and Science Act…

A new multi-year agreement has been signed that transitions the existing long-term supply by Wolfspeed Inc of Durham, NC, USA of silicon carbide (SiC) substrates to Infineon Technologies AG of Munich, Germany from 150mm-diameter to 200mm-diameter wafers…

XMax Inc of Commerce, CA, USA (formerly Nova LifeStyle Inc) — which designs, sources and distributes contemporary furniture but has diversified to also developing and providing artificial intelligence software and platform-based services — has agreed to acquire Hexa Creation Inc, a US-based company focused on 1200V vertical gallium nitride (GaN) power semiconductor technology for AI […]

Intelligent power and sensing technology firm onsemi of Scottsdale, AZ, USA says that its latest EliteSiC silicon carbide (SiC) hybrid power module technology has been adopted by renewable energy technology firm Sungrow for its PowerTitan 3.0 energy storage platform. The integration enables improved efficiency and enhanced system performance for utility-scale battery energy storage systems (BESS)…

Microchip Technology Inc of Chandler, AZ, USA has launched the POL-05-20S-T, a radiation-tolerant point-of-load (POL) converter, designed to address the demanding power requirements of space processing applications. The new device uses gallium nitride (GaN) power devices to deliver up to 20A of output current with high efficiency and power density…

VisIC Technologies Ltd of Ness Ziona, Israel — a fabless supplier of power conversion devices based on gallium nitride (GaN) transistors — and mobility technology company AVL are advancing their collaboration with the integration of VisIC’s D3GaN power module technology into AVL’s vehicle demonstrator…

Specialty analog foundry Tower Semiconductor Ltd of Migdal Haemek, Israel and high-performance semiconductor, Internet of Things (IoT) system and cloud connectivity service provider Semtech Corp of Camarillo, CA, USA have agreed to expand their 20-year partnership. Semtech will invest in securing dedicated silicon germanium (SiGe) capacity at Tower in support of its strong design wins […]

Lumentum Holdings Inc of San Jose, CA, USA (which designs and makes optical and photonic products for optical networks and lasers), Astera Labs Inc (which provides rack-scale AI infrastructure through purpose-built connectivity solutions) and Corning Inc are giving a joint demonstration of PCIe-over-optics connectivity for AI rack-scale architectures in Astera Labs’ booth #B34 at the […]