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Semiconductor Industry Daily News & Updates

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Semiconductor Industry Daily News & Updates

  • The Interface IP market has grown with 21% CAGR from 2017 to 2021 and we review the part of this market restricted to the high-end of PCIe, DDR, Ethernet and D2D IP made of PHY and controller targeting the most advanced technology nodes and latest protocol release. We will show that an IP vendor focusing […]
  • Extreme ultraviolet (EUV) lithography targets patterning pitches below 50 nm, which is beyond the resolution of an immersion lithography system without multiple patterning. In the process of exposing smaller pitches, stochastic patterning effects, i.e., random local pattern errors from unwanted resist removal or lack … Read More The post Predicting EUV Stochastic Defect Density appeared […]
  • After attending the TSMC and Samsung foundry conferences I wanted to share some quick opinions about the foundry business. Nothing earth shattering but interesting just the same. Both conferences were well attended. If we are not back to the pre pandemic numbers we are very close to it. TSMC and Samsung both acknowledged that there… […]
  • Current owners of a wide range of Hyundai connected cars encompassing multiple model years are receiving or have received notification of the availability (i.e. eligibility) for a software upgrade that will connect their in-vehicle radio to the Internet. For those owners who receive and have this update installed they may not… Read More The post […]
  • No doubt that the design success of nowadays system on chips (SoCs) is directly linked to the success of cost control. More market opportunities are open for less expensive system on chips and electronic systems. Both the design cost prediction and the resource tracking during the design process, are key to such a success Predicting… […]
  • Intel Foundry chief to step down; European Chips Act, Chinese plans; Netherlands in talks with U.S. about export restrictions; Cadence-UMC mmWave reference flow; Advantest debuts DR-SEM. The post Week In Review: Semiconductor Manufacturing, Test appeared first on Semiconductor Engineering.
  • NASA to build Moon roads; pre-silicon security; mobility report; U.S. DoD zero trust. The post Week In Review: Auto, Security, Pervasive Computing appeared first on Semiconductor Engineering.
  • Renesas configurable clock generators; traversing a wormhole; RISC-V; Keysight 5G network QoS monitoring. The post Week In Review: Design, Low Power appeared first on Semiconductor Engineering.
  • A research paper titled “HexaMesh: Scaling to Hundreds of Chiplets with an Optimized Chiplet Arrangement” was published by researchers at ETH Zurich and University of Bologna. Abstract: “2.5D integration is… » read more The post An Arrangement of Chiplets That Outperforms A Grid Arrangement (ETH Zurich / U. of Bologna) appeared first on Semiconductor Engineering.
  • A technical paper titled “Hardware Trojan Threats to Cache Coherence in Modern 2.5D Chiplet Systems” was published by researchers at Texas A&M University and NYU. Abstract: “As industry moves toward… » read more The post Hardware Trojans Target Coherence Systems in Chiplets (Texas A&M / NYU) appeared first on Semiconductor Engineering.
  • A technical paper titled “Circuit Activity Fingerprinting Using Electromagnetic Side-Channel Sensing and Digital Circuit Simulations” was published by researchers at Georgia Tech. The work “introduces a novel circuit identification method… » read more The post HW Security: Fingerprints Of Digital Circuits Using Electromagnetic Side-Channel Sensing & Simulations (Georgia Tech) appeared first on Semiconductor Engineering.
  • A technical paper titled “A 100-Gb/s PAM4 Optical Transmitter in a 3-D-Integrated SiPh-CMOS Platform Using Segmented MOSCAP Modulators” was published by researchers at CalTech and University of Southampton. “The resulting… » read more The post Chip Sandwich: Electronics Chip & Photonics Chip Co-Optimized To Work Together (CalTech/Univ. of Southampton) appeared first on Semiconductor Engineering.
  • A new technical paper titled “Efficient Computation of Map-scale Continuous Mutual Information on Chip in Real Time” was published by researchers at MIT. Find the technical paper here. “In this… » read more The post HW Accelerator Architecture for MI Computation With Low Latency, Energy Efficient (MIT) appeared first on Semiconductor Engineering.
  • A technical paper titled “Demonstration of Multiply-Accumulate Operation With 28 nm FeFET Crossbar Array” was published by researchers at Fraunhofer IPMS and GlobalFoundries. Abstract “This letter reports a linear multiply-accumulate… » read more The post MAC Operation on 28nm High-k Metal Gate FeFET-based Memory Array with ADC (Fraunhofer IPMS/GF) appeared first on Semiconductor Engineering.
  • Components of a comprehensive modern digital twin. The post Peeling The Onion Of An Automotive IC Digital Twin appeared first on Semiconductor Engineering.
  • Ascent Solar Technologies Inc of Thornton, CO, USA – which makes lightweight, flexible copper indium gallium diselenide (CIGS) thin-film photovoltaic (PV) modules that can be integrated into consumer products, off-grid applications and aerospace applications – has introduced options trading of its stock, via all US options exchanges…
  • Professor Rachel Oliver of the University of Cambridge’s Department of Materials Science and Metallurgy has been awarded a Royal Academy of Engineering Chair in Emerging Technologies. The award is worth £2.5m over ten years to develop emerging technologies with high potential to deliver economic and social benefits to the UK…
  • Transphorm Inc of Goleta, near Santa Barbara, CA, USA — which designs and manufactures JEDEC- and AEC-Q101-qualified gallium nitride (GaN) field-effect transistors (FETs) for high-voltage power conversion — has opened a new office in Shenzhen, China, which is fully operational and already serving the firm’s broad customer base in China…
  • In a signing ceremony at its headquarters in Kyoto, Japan-based power semiconductor device maker ROHM Co Ltd has entered into a strategic partnership agreement with China’s Shenzhen BASiC Semiconductor Ltd on silicon carbide (SiC) power devices for automotive applications…
  • STMicroelectronics of Geneva, Switzerland and engineered substrate manufacturer Soitec of Bernin, near Grenoble, France have announced the next stage of their cooperation on silicon carbide (SiC) substrates, with the qualification of Soitec’s SiC substrate technology by ST planned over the next 18 months. The goal is the adoption by ST of Soitec’s SmartSiC technology for […]
  • Midsummer AB of Järfälla, near Stockholm, Sweden – a provider of turnkey production lines as well as flexible, lightweight copper indium gallium diselenide (CIGS) thin-film solar panels for building-integrated photovoltaics (BIPV) – has signed new letters of intent (LOI) with four Swedish and international roof material producers, house manufacturers and solar cell installers for the […]
  • For coverage of all the key business and technology developments in compound semiconductors and advanced silicon materials and devices over the last month, subscribe to Semiconductor Today magazine…
  • The Italian Ministry of Finance’s state investment and economic development institution Invitalia has agreed the final contractual term sheet for grant payments supporting the factory investment by Midsummer AB of Järfälla, near Stockholm, Sweden – a provider of turnkey production lines as well as flexible, lightweight copper indium gallium diselenide (CIGS) thin-film solar panels for […]
  • To streamline the end-to-end design of photonic integrated circuits (PICs) and meet future demands of applications including datacom, telecom, LiDAR, healthcare, high-performance computing (HPC), artificial intelligence (AI) and optical computing, OpenLight of Santa Barbara, CA, USA has announced the general availability of its process design kit (PDK)…
  • Kyocera Corp of Kyoto, Japan has developed a new thin-film process technology for making unique silicon substrates for gallium nitride (GaN)-based micro-light sources (with a side measuring less than 100μm), including short-cavity lasers and micro-LEDs…