The semiconductor industry is entering a new era in system design. As traditional monolithic scaling approaches its economic and physical limits, multi-die architectures are emerging as a primary pathway for delivering continued improvements in performance, power efficiency, and integration density. By distributing … Read More The post Reducing Risk Early: Multi-Die Design Feasibility Exploration appeared […]

Ceva, Inc., a leading provider of silicon and software IP for the Smart Edge, has unveiled PentaG-NTN™, its groundbreaking 5G Advanced modem IP subsystem tailored for satellite user terminals in Low Earth Orbit (LEO) and Medium Earth Orbit (MEO) constellations. Announced at Mobile World Congress 2026 in Barcelona on March 3,… Read More The post […]

There’s no denying that verification now leads the field in agentic AI announcements, accelerating the trend around this significant contribution to design automation. Siemens have just announced their Questa One Agentic Toolkit, their response to this trend, building on the core Questa One platform. Questa One provides … Read More The post Siemens Reveals Agentic […]

Safety engineers, hardware designers and reliability specialists in safety-critical industries like automotive, aerospace, medical device and industrial automation use FMEDA (Failure Modes, Effects and Diagnostic Analysis). ISO 26262 compliance for ADAS, braking systems and ECUs require FMEDA in the automotive sector.… Read More The post Functional Safety Analysis of Electronic Systems appeared first on SemiWiki.

RVA23 marks a turning point in how mainstream CPUs are expected to scale performance. By making the RISC-V Vector Extension (RVV) mandatory, it elevates structured, explicit parallelism to the same architectural status as scalar execution. Vectors are no longer optional accelerators bolted onto speculation-heavy cores.… Read More The post RVA23 Ends Speculation’s Monopoly in RISC-V […]

AI integrity attacks; US weighs more AI chip authority; on-chip security controls; new chips at MWC; optical interconnect deals; CPO funding; 18A; diary of advanced lithographer; domain-scoped agentic AI; HBM4; automotive chips; BYD's 9-minute EV charge. The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

Traditional Ethernet security mechanisms were not designed for the scaling and trust assumptions of next‑generation networks. The post Ultra Ethernet Security (UET‑TSS) Tailored For AI And HPC appeared first on Semiconductor Engineering.

Enabling edge systems to handle terabytes of sensor data and execute real-time AI inference. The post 25G Ethernet: Scaling Data Movement For ADAS, Industry 4.0, And 5G Systems appeared first on Semiconductor Engineering.

Complex horizontal and vertical current flows create new failure modes that don't exist in 2D designs. The post Across The Vast Reaches Of The 3D Stack: Mastering ESD Verification In Advanced Semiconductor Design appeared first on Semiconductor Engineering.

The defining constraint that will shape GPU IP, SoC integration, and architectural tradeoffs for the next decade. The post Power, Not Area: Why Edge GPU Design Is Entering A New Era appeared first on Semiconductor Engineering.

OEMs are driving faster design cycles and enhanced security amid evolving vehicle architectures and compliance requirements. The post Auto Security Accelerates With Standardization And Certified Silicon appeared first on Semiconductor Engineering.

Tools designed to verify and monitor physical AI systems offer value, but human oversight is needed to prevent accidents and unexpected behavior. The post Limiting AI/ML Tools To Ensure Physical AI Safety, Security appeared first on Semiconductor Engineering.

Integrating a wireless chip and a microcontroller reduces complexity and improves power management. The post The New Design Advantage: Why Unifying Processing And Connectivity Simplifies The Design Experience appeared first on Semiconductor Engineering.

Exponential increases in data and a mix of performance requirements are driving a top-to-bottom rethinking of what works best where. The post New Automotive Architectures Are Shaking Up Processor And Memory Choices appeared first on Semiconductor Engineering.

The rise of localized computing facilities positioned physically close to where data is generated. The post Edge And Micro Data Centers: Powering The Real-Time Digital World appeared first on Semiconductor Engineering.

Marktech Optoelectronics Inc of Latham, NY, USA has announced an expanded portfolio of high-power UV LED light sources with new UV emitters spanning 230nm to 400nm. These devices strengthen the firm’s offerings across the ultraviolet light spectrum — from deep-UV LED (DUV LED, far-UVC LED) sterilization wavelengths to longer UVB and UVA wavelengths for curing, […]

Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has announced what it claims is the industry’s first commercially available 10kV SiC power MOSFET. The firm says this unlocks architectural freedom, delivering unprecedented system durability, and advancing access to reliable and sustainable power for the most […]

Based on assumptions on first-quarter memory prices (which indicate that pricing pressure and constrained supply will begin to ease in second-half 2026), Omdia’s latest outlook forecasts that global smartphone shipments will fall by about 7% year-on-year in 2026…

Satellite communication (Satcom) technology provider Circuits Integrated Hellas (CIH) of Athens, Greece and wireless power-at-a-distance technologies provider Reach Power of Redwood City, CA, USA, have announced a memorandum of understanding (MOU) establishing a multi-year strategic alliance. Focused on joint development of integrated radio frequency (RF)/millimeter-wave (mmWave) and wireless power and data transfer (WPDT) solutions, the […]

Mineral exploration company Volta Metals Ltd of Toronto, Canada (which owns, has optioned and is currently exploring a critical minerals portfolio of rare-earths, gallium, lithium, cesium and tantalum projects in Ontario) has begun laboratory-scale bioleaching recovery test work primarily targeting gallium and secondarily rare-earth elements (REEs) at Dr Vasu Appanna’s laboratory of Biomine Research and […]

High-performance semiconductor, Internet of Things (IoT) systems and cloud connectivity service provider Semtech Corp of Camarillo, CA, USA has acquired HieFo Corp of Alhambra, CA –which manufactures indium phosphide (InP) optoelectronic devices for optical transceivers used across data-center interconnects (DCI) and intra-data-center interconnects – for about $34m in cash…

In booth #2027 at the IEEE Applied Power Electronics Conference (APEC 2026) in San Antonio, Texas (22–26 March), Navitas Semiconductor Corp of Torrance, CA, USA is exhibiting a 250kW solid-state transformer (SST) platform developed by the Power Electronics Laboratory of Switzerland’s École Polytechnique Fédérale de Lausanne (EPFL) that enables the grid architecture required by next-generation […]

CoolSem Technologies of Eindhoven, the Netherlands (which was founded in 2025 and develops wafer-level thermal management technology to reduce thermal resistance and mechanical stress in advanced semiconductor and photonic devices) has established an Advisory Board to accelerate global growth and technology leadership…

Teck American Inc of Spokane, WA, USA (a subsidiary of Canada-based Teck Resources Ltd) has agreed to sell the past-producing Apex germanium (Ge), gallium (Ga) and copper (Cu) mine in Utah to Blue Moon Metals Inc of Toronto, ON, Canada, which says it will become a key stakeholder to support an integrated pipeline of US […]

The rapid rise of generative AI is driving continuous growth in demand for high-speed data transmission in data centers, notes market research firm TrendForce. Copper cable solutions, traditionally used for short-distance intra-rack interconnects, are increasingly facing challenges in both transmission density and energy efficiency…