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There were quite a few announcements at the Silicon Catalyst event at the Computer History Museum last week. The event itself was eventful with semiconductor legends in the audience and on the stage. First let’s talk about the announcements SCI made then we will talk about the event itself. In addition to expanding in Japan… […]

In the complex world of IC design, electrical verification has emerged as a critical yet often overlooked bottleneck. Aniah’s upcoming webinar on December 4, 2025, titled “Electrical Verification: The Invisible Bottleneck in IC Design,” sheds light on this issue, introducing their groundbreaking OneCheck® solution. … Read More The post WEBINAR: Revolutionizing Electrical Verification in IC Design appeared […]

By Todd Burkholder and Per Viklund, Siemens EDA The landscape of advanced IC packaging is rapidly evolving, driven by the imperative to support innovation on increasingly complex and high-capacity products. The broad industry trend toward heterogeneous integration of diverse die and chiplets into advanced semiconductor… Read More The post Hierarchically defining bump and pin regions […]

Verification is always a top priority for any chip project. Re-spins result in lost time-to-market and significant cost overruns. Chip bugs that make it to the field present another level of lost revenue, lost brand confidence and potential costly litigation. If the design is part of the avionics or control for an aircraft, the… Read […]

In the rapidly evolving landscape of connected devices, where artificial intelligence meets the physical world, Ceva  has unveiled a groundbreaking solution: the Ceva-Waves Wi-Fi 7 1×1 client IP. Announced on October 21, 2025, this IP core is designed to supercharge AI-enabled IoT devices and pioneering physical AI systems,… Read More The post Ceva Unleashes Wi-Fi […]

A new technical paper titled “Shrinking interconnects beyond copper” was published by researchers at Florida State University and Cornell University. Excerpt “The continuous downscaling of transistors in integrated circuits following Moore’s law—doubling the number of transistors on a microchip about every 2 years—has been an extraordinary feat of engineering, pushing the limits of fundamental physics…. […]

A new technical paper titled “Impact of Aging, Self-Heating, and Parasitics Effects on NSFET and CFET” was published by researchers at TU Munich and Indian Institute of Technology. Abstract “This work presents a comparative analysis of complementary field-effect transistor (CFET) and nanosheet FET (NSFET) architectures, with a focus on self-heating effects (SHEs), negative bias temperature… […]

Past, present, and future of managing wafer processes in the fab. The post Advanced Process Control In Semiconductor Manufacturing appeared first on Semiconductor Engineering.

Memory chip shortages prompt price increases; Israeli chip foundry; 2 acquisitions; Baidu's AI chips; IBM's new quantum processor; GF's GaN push; 3D NAND scaling boosters; U.S. policy recommendations; +$500M in fundings; SiPho and SiGe capacity; EV joint venture. The post Chip Industry Week in Review appeared first on Semiconductor Engineering.

Concern is growing in complex designs where there are few dedicated tools to help find and deal with it. The post Noise: A Chip Killer appeared first on Semiconductor Engineering.

Balancing the benefits provided by community and transparency with the risks posed by capacity and warranty issues. The post Opportunities And Challenges With Open-Source Hardware In System Development appeared first on Semiconductor Engineering.

Restore signal quality across long distances and complex topologies. The post Scaling AI Infrastructure: The Critical Role Of PCIe 7.0 Retimers appeared first on Semiconductor Engineering.

Inconsistent demand from multiple features can greatly increase the number of corner cases. The post Power Integrity And Voltage Issues Get Harder To Detect And Solve appeared first on Semiconductor Engineering.

Shift verification effort from a single, time-consuming flat run to a more efficient, distributed, and scalable process. The post Accellera Standard Supports Hierarchical Data Model For CDC And RDC Analysis appeared first on Semiconductor Engineering.

Compress multiple design scenarios into manageable sets while preserving critical timing information. The post Predictable Design Optimization And Closure With Adaptive Scenario Compression appeared first on Semiconductor Engineering.

Cadmium telluride (CdTe) thin-film photovoltaic (PV) module maker First Solar Inc of Tempe, AZ, USA is to establish a new facility in Gaffney, Cherokee County, South Carolina, to onshore final production processes for Series 6 Plus modules initiated by the company’s international fleet. The firm expects to spend about $330m to establish the new facility, […]

The South Wales-based compound semiconductor cluster CSconnected has announced a £1m third call in its Supply Chain Development Programme (which was launched in March), delivered in partnership with Cardiff Capital Region (CCR), to accelerate the expansion of the compound semiconductor supply chain in South Wales. The initiative aims to drive job creation, stimulate economic growth […]

Specialty analog foundry Tower Semiconductor Ltd of Migdal Haemek, Israel has announced the expansion of its existing, mature 300mm wafer bonding technology (originally developed and in mass production for stacked BSI image sensors) to enable heterogeneous 3D-IC integration across its silicon photonics (SiPho) and silicon germanium (SiGe) BiCMOS processes, including full support by Cadence design […]

Ascent Solar Technologies Inc of Thornton, CO, USA – which designs and makes lightweight, flexible copper indium gallium diselenide (CIGS) thin-film photovoltaic (PV) panels that can be integrated into consumer products, off-grid applications and aerospace applications – has signed a teaming agreement with Louisiana- and Texas-based NovaSpark Energy, which designs and manufactures mobile hydrogen generation […]

NUBURU Inc of Centennial, CO, USA — which was founded in 2015 and developed and previously manufactured high-power industrial blue lasers — has updated its strategic alliance with Tekne S.p.A. (a provider of integrated electronic warfare and cyber capabilities in military vehicles). The companies, along with Tekne’s shareholders, signed a new letter of agreement on […]

Cree LED Inc of Durham, NC, USA (a Penguin Solutions brand) has filed a patent infringement lawsuit in the US District Court for the Northern District of Illinois alleging that Promier Products (trading as LitezAll) and Tractor Supply Co have infringed its rights in the following patents by selling certain portable lighting products: United States […]

South Korea-based SK keyfoundry — which provides specialty analog and mixed-signal foundry services on 8-inch wafers for consumer, communications, computing, automotive and industrial applications — says that it is accelerating the development of silicon carbide (SiC)-based compound power semiconductor technology, bolstering its efforts for the global power semiconductor market. Leveraging its manufacturing expertise and intellectual […]

Infineon Technologies AG of Munich, Germany says that it is providing its gallium nitride (GaN) technology for the next generation of solar microinverters from global energy technology company Enphase Energy Inc, which is said to be the world’s leading supplier of microinverter-based solar and battery systems. Infineon’s CoolGaN bi-directional switch (BDS) technology enables significant enhancements […]

Led by Rensselaer Polytechnic Institute (RPI) of Troy, NY, USA, a team that also includes researchers at the National High Magnetic Field Laboratory, Florida State University and SUNY Buffalo has deepened the understanding of remote epitaxy, a manufacturing technique that entails growing high-quality semiconducting films on one substrate and then transferring them to a different […]

Photonic application-specific integrated circuit (PASIC) chip designer and manufacturer OpenLight of Santa Barbara, CA, USA (which launched as an independent company in June 2022, introducing the first open silicon photonics platform with heterogeneously integrated III-V lasers, modulators, amplifiers and detectors) says that, at the 15th International Symposium on Photonics and Electronics Convergence (ISPEC 2025) at […]