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Arteris is one of the most impressive companies SemiWiki has worked with over the last fifteen years. We have collaborated on one hundred and seventy-three articles/podcasts that have garnered more than two million views/listens. The success of Arteris can be easily tracked to the executive team and Kurt Shuler was the executive… Read More The […]

The explosive growth of artificial intelligence is transforming the semiconductor industry, and nowhere is this more evident than in the memory sector. AI training and inference workloads are fundamentally memory-intensive, driving unprecedented demand for advanced DRAM architectures, High Bandwidth Memory (HBM), and… Read More The post The Memory Sector Is Becoming One of the Main […]

Embedded systems programs rarely fail because of a lack of execution capability. They fail because critical engineering documentation drifts out of alignment over time and distance. Simply put, the team is correctly following the wrong instructions. This includes requirements, architecture, implementation, verification,… Read More The post WEBINAR: Engineering Documentation is a Critical Source of Truth […]

As semiconductor designs continue to grow in complexity, FPGA prototyping has become an essential component of modern pre-silicon validation strategies. While FPGA capacity and gate-count equivalence often dominate discussions around prototyping platforms, the true value of an FPGA prototype lies elsewhere: its ability… Read More The post Technical Paper: FPGA Prototyping That Creates Useful PreSilicon […]

The most common question that I get each year at DAC is, “So, what’s new?” When I reviewed the exhibitor list I was pleasantly surprised to see how many EDA, IP and AI companies were attending that I didn’t know about. Here’s just a quick preview of what to expect in Long Beach from July […]

Researchers from National Yang Ming Chiao Tung University (NYCU) and Chung Yuan Christian University have published “A Cross-Validated DSPN and Worst-Case Response-Time Framework for Timing Analysis of Automotive CAN Networks”. Abstract “Controller Area Network (CAN) remains a key in-vehicle communication protocol for distributed automotive control systems, where predictable communication timing is essential for coordinated operation… […]

Researchers from The University of Osaka, National Institute for Fusion Science, National Institutes for Quantum Science and Technology, and Osaka Metropolitan University, et al. have published “Optimization of EUV output by experimentally validated radiation-hydrodynamic simulations across a broad laser parameter space”.   Abstract “Practical requirements such as improving wall-plug efficiency and reducing system footprint have… […]

Researchers from Hanyang University, Korea University, and Korea Institute of Industrial Technology have published “Failure-Aware Refinement of Vision-Language Model for Lithography Defect Detection”. Abstract “Semiconductor lithography inspection requires reliable detection of small pattern defects such as bridge, burr, pinch, and contamination. In this study, we propose a two-stage vision-language framework that combines initial defect detection… […]

Researchers from Utsunomiya University, RIKEN, The University of Tokyo, and Tohoku University, et al. have published “40% boost in extreme ultraviolet conversion efficiency via simultaneous dual-beam 2-µm laser irradiation”. Abstract “Scaling extreme ultraviolet (EUV) source power for next-generation lithography demands higher conversion efficiency (CE) at reduced per-pulse energies. We demonstrated a 40% CE enhancement by… […]

14A PDKs; 2nm funding; memory deal; optimizing EUV output; KGD screening; McKinsey's auto chips report; HW security exploits; humanoids; H-1B policy; diamonds for heat; Europe's IC progress; imec's latest; fault-tolerant quantum HW; AI for EDA ontology. The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

Standalone GPUs are being replaced by heterogeneous SoCs and chiplets that combine CPUs, GPUs, and NPUs to eliminate memory bottlenecks, reduce latency, and boost efficiency. The post Agentic AI Is Changing Data Center Architectures appeared first on Semiconductor Engineering.

It depends on what those models are used, which also can have a big impact on the cost. The post Can AI Create Missing Models? appeared first on Semiconductor Engineering.

Multiphysics analysis for advanced packaging. The post Mastering 3D-IC Verification Complexity appeared first on Semiconductor Engineering.

Reliable performance at higher data rates requires tight coordination between clocking, power delivery, and system-level management. The post Clocked DDR5 Client Memory Modules Enable Scaling To 9600 MT/s For AI PCs appeared first on Semiconductor Engineering.

Packet-based architecture enables out-of-order execution to optimize hardware utilization without retraining the model. The post How To Start Building Edge-Native AI appeared first on Semiconductor Engineering.

Photonic simulation CAD software developer Photon Design Ltd of Oxford, UK has added a silicon modulator design capability to its HAROLD semiconductor and laser simulation tool, across a range of geometries…

Guerrilla RF Inc (GRF) of Greensboro, NC, USA — which provides radio-frequency integrated circuits (RFICs) and monolithic microwave integrated circuits (MMICs) for wireless applications — has announced the production launch of its GRF5847 linear power amplifier (PA) module, which combines fully integrated 50Ω input and output matching with what is claimed to be exceptional output […]

Volta Metals Ltd of Toronto, Canada (which owns, has optioned and is currently exploring a critical minerals portfolio of rare-earths, gallium, lithium, cesium and tantalum projects in Ontario) says that the Ontario government has awarded funding of up to $500,000 under the Critical Minerals Innovation Fund (CMIF) for work on the its Springer Rare Earth […]

Mining exploration company Nimy Resources Ltd of Perth, Western Australia and Perth-based Curtin University are to undertake what is described as a pioneering research program into processing gallium…

Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has announced the first commercial acceptance and qualification of its LUMINA+ metal-organic chemical vapor deposition (MOCVD) system by Ennostar Corp of Hsinchu, Taiwan (a provider of integrated optoelectronic solutions, specializing in R&D and manufacturing III-V materials). The order is said to set […]

Nanoelectronics research center imec of Leuven, Belgium is evolving its 300mm RF silicon interposer into a system-level platform for the heterogeneous integration of III–V chiplets on Si-CMOS. By uniquely combining high-density embedded capacitors, a scalable modeling framework for passive components and laser-assisted bonding for III–V chiplet assembly, the platform lays the foundation for next-generation wireless […]

US-based aerospace & defense technology company Northrop Grumman Corp has fabricated a new gallium nitride (GaN) chip that sets what is claimed to be a new performance standard for military and commercial use…

Deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany has announced a strategic production partnership with ROHM Semiconductor, which has selected Aixtron’s G10-GaN metal-organic chemical vapor deposition (MOCVD) system to establish in-house gallium nitride (GaN) epitaxy at its Hamamatsu plant in Japan. The system is currently ramping for volume production of 8-inch GaN epitaxial […]

Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — has introduced the EPC91132, a compact 3-phase BLDC motor drive inverter reference design based on the EPC33110 GaN three-phase module…

Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — says that its new EPC2378 25V eGaN power transistor has entered mass production, enabling high-density power system designers to achieve higher efficiency, faster switching […]