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Semiconductor Industry Daily News & Updates

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Semiconductor Industry Daily News & Updates

  • -Micron reports weak outlook for fiscal Q4 -2023 capex to be down versus 2022 capex of $12B & Q3’s $2B -Company keeping inventory off street to support pricing -Memory is usually the first shoe to drop in a down cycle Sharp drop in demand at end of Q3….. Micron reported a sharp drop in demand […]
  • -Chip cycle will come down. Only question is landing impact -What does cyclical end do to re-shoring & build out plans? -Is it less demand, excess supply or both? Does it matter? -CHIP Act rescue efforts get desperate switching to threats Any landing you can walk away from is a good one For those of […]
  • 3D-ICs bring together multiple silicon dies into a single package that’s significantly larger and complex than traditional systems on a chip (SoCs). There’s no doubt these innovative designs are revolutionizing the semiconductor industry. 3D-ICs offer a variety of performance advantages over traditional SoCs. Because … Read More The post The Lines Are Blurring Between System […]
  • Everything is becoming digital, and everything digital requires semiconductors. Cadence’s President and CEO, Dr. Anirudh Devgan, highlighted this at the recent CadenceLIVE user conference and discussed many of the company’s accomplishments and future directions. Dr. Devgan also sees the emergence of data—especially … Read More The post Cadence Execs Look to the Future appeared first […]
  • The ESD Alliance collects and reports every quarter the revenue trends for both EDA and Semiconductor IP (SiP), and the biggest component for the past few years has been the SiP, as IP re-use dominates new designs. For Q4 of 2021 the total SiP revenue was $1,314.3 Million, enjoying a 24.8% growth in just one […]
  • New research paper titled “Hybrid silicon photonics DBR laser based on flip-chip integration of GaSb amplifiers and µm-scale SOI waveguides” by researchers at Tampere University (Finland). Abstract: “The development of integrated photonics experiences an unprecedented growth dynamic, owing to accelerated penetration to new applications. This leads to new requirements in terms of functionality, with the… […]
  •   New research paper titled “Hertzbleed: Turning Power Side-Channel Attacks Into Remote Timing Attacks on x86” from researchers at UT Austin, University of Illinois Urbana-Champaign (UIUC) and University of Washington can be found here. (preprint). This paper will be presented at the 31st USENIX Security Symposium (Boston, 10–12 August 2022). Summary explanation of the Hertzbleed side-channel… […]
  • Research paper titled “Synaptic transistors with a memory time tunability over seven orders of magnitude” from researchers at The University of Manchester (UK) and Shandong Technology Center of Nanodevices and Integration, School of Microelectronics, Shandong University, China. Abstract “The human brain is capable of short- and long-term memory with retention times ranging from a few… […]
  • Technical paper titled “The functions of a reservoir offset voltage applied to physically defined p-channel Si quantum dots” from researchers at Tokyo Institute of Technology and Device Technology Research Institute (D-Tech), National Institute of Advanced Industrial Science and Technology (AIST). Abstract “We propose and define a reservoir offset voltage as a voltage commonly applied to… […]
  • New technical paper titled “A Scalable Emulator for Quantum Fourier Transform Using Multiple-FPGAs With High-Bandwidth-Memory” from researchers at Tohoku University in Japan. Abstract: “Quantum computing is regarded as the future of computing that hopefully provides exponentially large processing power compared to the conventional digital computing. However, current quantum computers do not have the capability to… […]
  • New technical paper titled “All-in-one, bio-inspired, and low-power crypto engines for near-sensor security based on two-dimensional memtransistors” from researchers at Penn State University. Abstract: “In the emerging era of the internet of things (IoT), ubiquitous sensors continuously collect, consume, store, and communicate a huge volume of information which is becoming increasingly vulnerable to theft and… […]
  • Samsung's 3nm; Imec's interconnect news; CHIPS Act updates; Russian exports; education partnerships; quantum network consortium; laser breakthrough The post Week In Review, Manufacturing, Test appeared first on Semiconductor Engineering.
  • Domain-specific logic simulation; new Arm CPUs, GPUs; high-frequency RF/MW simulation; memory, AMS design; Accenture buys XtremeEDA. The post Week In Review: Design, Low Power appeared first on Semiconductor Engineering.
  • Global automotive chip market; auto deaths; viewers control sports 3D broadcasts; CEVA/Flex Logix ISA on the fly. The post Week In Review: Auto, Security, Pervasive Computing appeared first on Semiconductor Engineering.
  • New technology requires robust security, bandwidth, and electronic systems performance. The post Risks Rise As Robotic Surgery Goes Mainstream appeared first on Semiconductor Engineering.
  • Engineered materials and optoelectronic component maker II-VI Inc of Saxonburg, PA, USA has completed its acquisition of Coherent Inc of Santa Clara, CA (which provides lasers and laser-based technology for scientific, commercial and industrial applications)…
  • On 30 June, Fraunhofer Institute for Applied Solid State Physics IAF in Freiburg, Germany officially inaugurated two new buildings with a ceremonial ribbon-cutting by executive director professor Rüdiger Quay, Freiburg’s mayor for construction professor Martin Haag, and managing director of Freiburg Wirtschaft Touristik Messe GmbH & Co KG (FWTM) Hanna Böhme…
  • Photonics and microelectronic device assembly & packaging equipment maker Palomar Technologies Inc of Carlsbad, CA, USA has announced the consignment of an SST 5100 vacuum reflow furnace at the Electronics and Photonics Innovation Centre (EPIC) in Paignton, Torbay, UK. The focus will be on delivering higher-quality optoelectronics packaging for several different applications…
  • Purdue University in West Lafayette, IN, USA says that the Patent Trial and Appeal Board at the US Patent and Trademark Office has denied STMicroelectronics’ challenge to the patentability of its US patent 7,498,633 involving silicon carbide (SiC)…
  • Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA has launched the EPC7004, a 100V, 7mΩ, 160APulsed, radiation-hardened enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistor (FET) in a small 6.56mm2 footprint. The EPC7004 has a total dose radiation rating greater than 1Mrad and (single-event effect) immunity for LET (linear energy transfer) of […]
  • Gallium nitride (GaN) power integrated circuit firm Navitas Semiconductor of El Segundo, CA, USA and Dublin, Ireland says that its GaNFast power ICs with GaNSense technology are driving the 100W fast chargers supplied ‘in-box’ in the latest Redmi laptop family of Chinese consumer electronics firm Xiaomi Corp…
  • POET Technologies Inc of Toronto, Ontario, Canada has announced the availability of its 400G FR4 and 800G (2x400G FR4) receive (RX) optical engines based on the POET Optical Interposer, a unique hybrid integration photonics packaging platform…
  • Among many micro-LED display applications, micro-LED micro-displays will be the next new high-end product following on from large-scale display development, according to TrendForce’s latest micro-LED research report…
  • AquiSense Technologies LLC of Erlanger, KY, USA (which designs and manufactures water, air and surface disinfection systems based on UV-C LEDs) has developed the PearlAqua Tera, the first North American UV LED disinfection system designed for municipal and industrial markets. The first installation of the Tera is set for the Las Vegas Valley Water District, […]
  • Intel Labs of Santa Clara, CA, USA has announced advances in multi-wavelength integrated optics, including the demonstration of an eight-wavelength distributed feedback (DFB) laser array that is fully integrated on a silicon wafer and delivers output power uniformity of ±0.25dB and wavelength spacing uniformity of ±6.5% that exceed industry specifications…