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The semiconductor industry crossed $1 trillion in annual revenue this year, almost four years ahead of earlier projections. SEMI President and CEO Ajit Manocha opened the CEO Summit at SEMICON West with a chart that told the story. A year ago, the forecast for 2030 was $1 trillion. Now it is $2 trillion, with $3 […]

On October 15–16, at the tail end of SEMICON West 2026, PDF Solutions held its 2026 CONNECT Conference at the Westin St. Francis in San Francisco. PDF Solutions Vitals Santa Clara–based PDF Solutions is a semiconductor data, analytics, and connectivity company, founded in 1991. Today, its business rests on three pillars, all … Read More […]

An effective learned power model for a CPU could be a significant advantage in early estimation of power performance against realistic workloads in complex architectures. Paul Cunningham (GM, Verification at Cadence), Raúl Camposano (Silicon Catalyst, entrepreneur, former Synopsys CTO and lecturer at Stanford, EE292A)… Read More The post ML-Based Power Models for CPUs. Innovation in […]

Semiconductor manufacturing has always depended on precise measurement. As devices become more complex and packaging integrates more components, however, measuring individual process steps is no longer enough. Manufacturers need to understand how decisions across fabrication, assembly, and test affect the finished … Read More The post From Metrology to Autonomy: Why Intel Foundry’s Manufacturing Roadmap […]

Most of the AI conversation stops at the chip. At SEMICON West 2026 I sat down with René Jonker, Chief Product Officer of Soitec, to talk about what sits underneath it. Ask an engineer where AI performance comes from and you will hear about process nodes, dataflow, HBM stacks and interconnect fabrics. Rarely about the […]

Technology is only useful if it improves an existing methodology. Property generation is still refining that goal, but in the long term it could be very useful. The post Auto-Generation Of Properties: Methodology Insertion appeared first on Semiconductor Engineering.

Is it better to do everything earlier in the flow, or should design be more flexible and iterative? The post Rethinking Shift Left In Chip Design appeared first on Semiconductor Engineering.

Universities are redesigning curricula and assessments around judgment, validation, and technical depth. The post AI Raises The Bar For Tomorrow’s Engineers appeared first on Semiconductor Engineering.

What biological reasoning can teach us about verifying silicon systems. The post The Complexity Between The Bits appeared first on Semiconductor Engineering.

Applying the appropriate level of simulation and abstraction at each stage of the design process is key to effective thermal analysis. The post Is It Getting Hot In Here? Why Thermal Is No Longer A Signoff Problem appeared first on Semiconductor Engineering.

What self-verifying agents validate their decisions against and why physics-based engines are the authority on correctness. The post Physics-Based Validation: The Foundation Of Trustworthy Agentic EDA appeared first on Semiconductor Engineering.

Determining which products may fall within the CRA's scope and what information may need to be provided to customers. The post The EU Cyber Resilience Act Reaches Chip And IP Suppliers appeared first on Semiconductor Engineering.

Separate false failures caused by voltage droop from real structural defects. The post From Functional Monitoring To In-System Test: Extending Voltage-Aware Observability appeared first on Semiconductor Engineering.

Solving difficult bugs while intelligently deciding what to investigate, what to rerun, and where to spend compute. The post Scaling Autonomous Root Cause Analysis For Regression Triage appeared first on Semiconductor Engineering.

Physics-based analysis becomes more consequential as chips, packages, boards, and systems are designed together. The post Why Physics Needs To Move At The Pace Of Design appeared first on Semiconductor Engineering.

For three decades, white LEDs have depended on rare-earth materials such as yttrium aluminium garnet (YAG) layered onto a blue LED chip (Figure 1). Opto-semiconductor device maker Seoul Viosys Co Ltd (SVC) says that it has now broken that dependence by developing and mass producing a chip that emits white light without rare earths. The […]

Cadmium telluride (CdTe) thin-film photovoltaic (PV) module maker First Solar Inc of Tempe, AZ, USA has inaugurated the first phase of its new $330m facility in Gaffney, Cherokee County, South Carolina, which onshores final production processes for the firm’s Series 6 Plus modules initiated by its international fleet…

Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has announced a multi-year agreement to supply its 1200V silicon carbide devices for the next-generation 800V SiC-based inverter platform of BorgWarner Inc of Auburn Hills, MI, USA (which provides sustainable mobility solutions for the vehicle market) as […]

Ascent Solar Technologies Inc of Thornton, CO, USA — which designs and makes lightweight, flexible copper indium gallium diselenide (CIGS) thin-film photovoltaic (PV) panels that can be integrated into consumer products, off-grid applications and aerospace applications — was co-host of an executive networking event on 20 October in Willow Springs, California, that brought together leaders […]

AXT Inc of Fremont, CA, USA — which makes gallium arsenide (GaAs), indium phosphide (InP) and germanium (Ge) substrates and raw materials at plants in China — says that its majority-owned China-based wafer manufacturing subsidiary Beijing Tongmei Xtal Technology Co Ltd has entered into definitive agreements for a private equity financing to fund further expansion […]

SemiQ Inc of Lake Forest, CA, USA — which designs, develops and manufactures custom silicon carbide (SiC) power semiconductors and 150mm SiC epitaxial wafers for high-voltage applications — has announced the availability of its fourth-generation QSiC silicon carbide power devices, launching a family of 1200V and 750V SiC bare dies and MOSFETs…

Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA — which makes enhancement-mode gallium nitride on silicon (eGaN) power field-effect transistors (FETs) and integrated circuits for power management applications — has announced the availability of the EPC91124 and EPC91125, two new 100V three-phase brushless DC (BLDC) motor drive evaluation boards designed to simplify the […]

Infineon Technologies AG of Munich, Germany is establishing the world’s first high-volume manufacturing facility for gallium nitride (GaN) power semiconductors on 300mm wafers in Europe. As part of the project, the firm will invest about €1.1bn in its existing cleanroom facilities at the site in Villach, Austria by 2034. Leveraging both the existing and upgraded […]

Infineon Technologies AG of Munich, Germany is to supply what is said to be the world’s first 900V gallium nitride (GaN) monolithic bidirectional switches (BDS) to Enphase Energy Inc of Fremont, CA, USA (which supplies microinverter-based solar and battery systems) for deployment in its solid-state transformer (SST) power modules. By extending the operating voltage range […]

University of Illinois at Urbana-Champaign (UIUC) has achieved a record modulation bandwidth of 2.75GHz in a gallium nitride (GaN) blue micro-LED (Abdelghany Abouelnagga et al…