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TSMC’s 2026 Open Innovation Platform Forum presented artificial intelligence as the force reshaping semiconductor design. Its central argument is that faster chips will require progress across the whole system: logic, memory, packaging, interconnects, power delivery and design methods. TSMC places its partner ecosystem… Read More The post TSMC 2026 OIP Ecosystem Forum Summary appeared first […]

It’s an honor to attend events like this as a guest, and even more so as a speaker. On Friday at 3:30 p.m., I’ll be moderating a panel with the CEOs of three of the hottest AI startups. I definitely have a few questions ready for them!  My beautiful wife and I will also be […]

Intel Foundry published a two article series on chip power delivery that are worth reading. Here is a quick summary: Artificial intelligence is changing the requirements for semiconductor innovation. Faster transistors and denser packaging remain essential, but their benefits increasingly depend on another engineering… Read More The post Data Center Energy Trends Force a Rethink […]

The rapid growth of AI at the edge is forcing SoC architects to rethink traditional processor designs. Dedicated NPUs deliver impressive performance for today’s models, but evolving AI workloads, increasing system complexity and growing pressure on power and silicon budgets are exposing the limitations of fixed-function… Read More The post WEBINAR: The Convergence of Edge […]

By Bhanu Pandey The semiconductor industry is currently facing a significant challenge in functional verification. According to the most recent Wilson Research Group / Siemens EDA Functional Verification Study, first-silicon success rates have hit a historic low, with nearly 68% of designs requiring two or more spins. While… Read More The post The silent killer […]

$2B foundry pact; hyper-NA EUV; TSMC, Samsung financials; Canon readies nanoimprint; AI chips under scrutiny; $10T data center buildout; $1.5B SiC boost; chip smuggling; 800V power gains traction; quantum HW scales up; wireless EV road charging; sub-nm gate dielectrics; mobile fab. The post Chip Industry Week In Review appeared first on Semiconductor Engineering.

How complementary inspection and metrology techniques can detect smaller defects and distinguish among a wide range of defect types within a unified workflow. The post Finding Critical Defects Before They Become Costly Failures: Process Control For Hybrid Bonding And Advanced Packaging appeared first on Semiconductor Engineering.

How optimized plasma processing can achieve effective surface roughening and activation. The post Demonstrating Plasma As A Viable Alternative To KOH For LCP Metallization Applications appeared first on Semiconductor Engineering.

More measurements don’t eliminate blind spots when each view captures only part of the device. The post Closing The Visibility Gap appeared first on Semiconductor Engineering.

The next generation of industry leaders may look very different from the last. The post From Silicon To Systems: Redefining Competitive Advantage, Part 3 appeared first on Semiconductor Engineering.

Streaming sensor data creates new challenges for advanced process control. The post Shift Left Complicates Fab Data Management appeared first on Semiconductor Engineering.

An integrated methodology for accelerating process development and sustaining production control for advanced packaging technologies. The post From Process Learning To Production Control: Trends In Advanced Packaging And Implications To Characterization And Test appeared first on Semiconductor Engineering.

The next frontier in process control isn’t just visual—it’s electrical. The post The FAaST Track: Enabling Advanced Packaging Through Electrical Process Control appeared first on Semiconductor Engineering.

Test vendors are adapting to changing connector architectures and extreme alignment tolerances as co-packaged optics heads toward mainstream. The post CPO Testing Faces A Moving Target Problem appeared first on Semiconductor Engineering.

Testing every device under real-world conditions has never been more important. The post Perspectives On Test: System Level Test For AI & Data Centers appeared first on Semiconductor Engineering.

CML Microsystems Plc of Maldon, UK — a designer and fabless manufacturer of mixed-signal, RF and microwave semiconductors for communications applications — has launched the CMX90A002, a compact power amplifier for next-generation ISM-band radio designs…

As artificial intelligence workloads are redefining the power requirements of modern data centers, increasing GPU performance and rising rack densities are driving a shift toward 800VDC or ±400VDC power supply architectures. To address these requirements, Infineon Technologies AG of Munich, Germany is launching a 27kW three-phase power supply unit (PSU) solution for server ODMs and […]

Wolfspeed Inc of Durham, NC, USA — which makes silicon carbide (SiC) materials and power semiconductor devices — has received a conditional loan commitment letter from the US Department of War (DoW), through its Office of Strategic Capital (OSC), for up to $1.5bn of long-term (30-year) financing to support the domestic development and production of […]

Photonic simulation CAD software developer Photon Design Ltd of Oxford, UK has enhanced the performance of its recently released HAROLD QD 3D quantum dot simulation tool…

In the latest update of its RF GaN Technology Patent Monitor, KnowMade says that more than 110 new patent families were published during second-quarter 2026…

KnowMade’s latest Lateral Power GaN Patent Monitor update on inventions, patent grants and emerging players across the power gallium nitride (GaN) supply chain shows that second-quarter 2026 was led by industrial patent assignees, while several Chinese universities maintained a strong presence in GaN power device innovation…

Materials technology company Mivium Inc of Fremont, CA, USA has achieved the production of high-purity submicron gallium nitride (GaN) particles using its proprietary technology platform (which extends to additional wide-bandgap and advanced semiconductor materials including gallium oxide and boron nitride)…

Gallium nitride (GaN) power IC and silicon carbide (SiC) technology firm Navitas Semiconductor Corp of Torrance, CA, USA has completed its acquisition (announced on 25 August) of power management solutions company Claros Inc — which is developing integrated voltage regulator (IVR) technology for next-generation AI data centers — providing the last step to powering the […]

Qorvo Inc of Greensboro, NC, USA (which provides core technologies and RF solutions for mobile, infrastructure and defense applications) has announced a C-band radar solution that adds receiver frequency agility and reduces DC power and heat in the transmit chain. Designed for pulsed ESA (electronically scanned array) systems, the solution combines what is reckoned to […]

Qorvo Inc of Greensboro, NC, USA (which provides core technologies and RF solutions for mobile, infrastructure and defense applications) has announced an X-band RF front-end solution that combines high transmit output with low-noise, high-linearity receive performance for active electronically scanned array (AESA) radar. Developed around a quad architecture, the solution reduces RF content inside the […]